75. Microcircuits, Bipolar, Programmable Logic Arrays, Up to 200 Gates Microcircuits, Bipolar, Memories, ROM, PROM Up to 16K Diodes, Transient Suppressor/Varistor Microcircuits, MOS, Floating Gate Programmable Logic Array, 5,001 to 20,000 Gates Microcircuits, GaAs MMIC 101 to 1,000 Active Elements Capacitors, Tantalum, Chip, CWR, MIL-C-55365 84. Mixer diode: #71 Comments/Questions/Consulting: The handbook is intended to be used as a tool to increase the reliability of the equipment being designed. 14. Microcircuits, Bipolar, Linear, 1 - 100 Transistors Microcircuits, Bipolar, Memories, ROM, PROM 16K to 64K Attenuator: #98 27. Der MTBF Berechnungsstandard Mil-HDBK-217 ist der älteste Standard seiner Art, wird allerdings seit seiner endgültig letzten Ausgabe F, Notice 2 von 1995 nicht mehr aktualisiert. 189. Our trials last for 30 days and are fully featured versions of our programs with only a few minor restrictions. 30. Rotating Devices, Stepper Motor Lamps, Incandescent, DC Microcircuits, MOS, Gate/Logic Arrays, Digital, 101 to 1,000 Gates less than 200 MHz, General purpose, bipolar/BJT) Telcordia SR332 Issue 4 . mil-hdbk-217f [document] Submitted on 18 March, 2010 - 07:54 Standards groups Microcircuits, MOS, Gate/Logic Arrays, Digital, 1,001 to 3,000 Gates Resistors, Nonwirewound, Variable, RJR, MIL-R-39035 Relays, Solid State, All MIL-HDBK-217F Notice 2 Electronic Reliability Prediction. MIL-HDBK-217F DEPARTMENT OF DEFENSE WASHINGTON DC 20301 RELIABILllY PREDICTION OF ELECTRONIC EQUIPMENT 1. Opto-electronics, Emitter (Light Emitting Diode, LED) 72. ²ç¶“是15年前的舊東西,現由rac prism代替了,可到以下的網頁下載30天的試用版(但是零件數量有限制喔). 197. Microcircuits, GaAs MMIC 1 to 100 Elements 102. 66. MIL-HDBK-217F, Notice 2, 28 Feb 1995, Reliability Prediction of Electronic Equipment, Chandler, Gregory; Denson, William K.; Rossi, Michael J.; Wanner, Richard. 114. 7. 131. 101. Microcircuits, MOS, Gate/Logic Arrays, Digital, 1 to 100 Gates less than 1W) Diodes, Current Regulator greater than 1W, bipolar/BJT) Microcircuits, MOS, Microprocessors Up to 16 Bits He states that reliability requirements should include: 1) quantified reliability requirements and allowable uncertainties. 96. MIL-HDBK-17 Secretariat, 500 Office Center Drive, Suite 250, Fort Washington, PA 19034. 105. 49. 4) On the Document Details page, near the bottom of the page, there are PDF icons for the various document revision PDF images. 87. 3. Transistors, RF. 20. MIL-HDBK-217 is very well known in military and commercial industries. Live interactive demonstrations are also available over the internet on a one-to-one basis. 40. Opto-electronics, Opto-lsolator (Optocoupler) 3. 133. Diodes, Tunnel and Back Connectors, Rectangular 126. Resistors, Film, Network, RZ, MIL-R-83401 MIL-HDBK-217F DEPARTMENT OF DEFENSE WASHINGTON DC 20301 RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT 1. 150. rarely used in practice. 182. 57. Switches, Sensitive Resistors, Film, RN, MIL-R-10509 F Download File - 12.36 MB … 48. Gilbert F. Decker signed a short policy statement in a memorandum. 16. 86. 187. Today, its adequacy with the evolution of components and el 82. 115. 180. Connectors, IC Sockets DIP, SIP, PGA 113. 63. Microcircuits, Bipolar, Programmable Logic Arrays, 1,001 to 5,000 Gates 6. Telcordia Technologies SR-332, Telcordia Technologies, Inc., No. 65. 207. Single Connections, Clip Termination Rotating Devices, Motors, General Rotating Devices, Synchros Microcircuits, MOS, Gate/Logic Arrays, Digital, 3,001 to 10,000 Gates 90. The first three volumes of this handbook currently focus on, but are not limited to, polymeric composites intended for aircraft and aerospace vehicles. 99. 4. Microcircuits, Bipolar, Gate/Logic Arrays, Digital, 1 - 100 Gates Microcircuits, Bipolar, Linear, 1001 - 10,000 Transistors The first row is used for column labels initially; however, this row is available for use by deleting/overriding the labels. 136. 18. 203. Microcircuits, MOS, Memories, SRAM, (MOS and BiMOS) 64K to 256K Diodes, Varactor greater than 200 MHz, Pwr. Resistors, Wirewound, Power, Chassis Mounted, RER, MIL-R-39009 mil-hdbk-217f探讨_专业资料 2507人阅读|24次下载. 208. The discipline’s first concerns were electronic and mechanical components (Ebeling, 2010). 144. Microcircuits, MOS, Memories, DRAM 16K to 64K 181. 73. If anything is entered into the user defined column (e.g., a part number), then this column will appear in the output, otherwise it is omitted. 6. reliabilityanalytics.com, Failure Rate Estimates for Mechanical Components, parts count reliability prediction procedure, complete document from DoD assistdocs.com, DigiKey Electronics (component part number search), ANSI/VITA 51.1-2008 (R2013), Rel Pred MIL-HDBK-217 Sub Spec, Frequently Asked Questions on ANSI/VITA 51.1-2008 (R2013) Rel Pred MIL-HDBK-217 Sub Spec. quality levels to a value of 3 and will select one level better than worse case for all other part types. MIL-HDBK-217 NSWC; Free Trials and Demos. Inductive Devices, Coil, Variable Inductor, MIL-C-15305 60. 98. 110. 116. Electronic Filters, Ceramic-Ferrite, MIL-F-15733 MIL-HDBK-217’s official name is Military Handbook: Reliability Prediction of … Diodes, Switching Inductive Devices, Transformer, RF, MIL-T-55631 Capacitors, Tantalum, Non-Solid, CL, MIL-C-3965 157. 206. 164. Microcircuits, MOS, Memories, SRAM, (MOS and BiMOS) Up to 16K Resistors, Wirewound, Variable, RT, MIL-R-27208 MIL-STD-967 covers the content and format for defense handbooks. Microcircuits, MOS, Microprocessors Up to 8 Bits Rotating Devices, Resolvers Berücksichtigt man, dass MTBF Berechnungsstandards auf Felderfahrungen beruhen, dann stützt sich die letzte Ausgabe des Mil-HDBK-217 auf mittlerweile 25 Jahre alte Felddaten. 19. 78. 160. 183. The descriptions of these environments are shown in the following table. 42. 168. Bellcore GR-1217-CORE, Bellcore, No. All part reliability models include the effects of environmental stresses through the environmental factor π E (except for the effect of ionizing radiation). Ground, Benign, G B Non-mobile, temperature and humidity controlled environments readily accessible to maintenance; includes laboratory instruments and test equipment, medical electronic equipment, business and scientific computer complexes, and missiles and support … It also establishes a common basis for comparing and evaluating reliability predictions of related or competitive designs. 1). MIL-HDBK-217F Environmental Conditions. Bipolar transistor: #76, #77 or #83 Microcircuits, MOS, Linear, 101 to 300 Transistors Transistors, GaAs FET (Pwr. Microcircuits, MOS, Memories, DRAM 256K to 1 MB 25. [Failures per 10 6 Operating hours] Thanks, Leonid Boim. 5. Inductive Devices, Transformer, Audio, MIL-T-27 Microcircuits, Bipolar, Microprocessors Up to 8 Bits 88. Resistors, Wirewound, Variable, RTR, MIL-R-39015 166. 142. 177. 12. Relays, General Purpose (Balanced Armature) Connectors, RF Coaxial (SMA, TNC) 9. Opto-electronics, Alphanumeric Display 124. Capacitors, Variable, Air Trimmer, CT, MIL-C-92 The part quantity column (last column) defaults to 1 if nothing is entered into this field. Resistors, Film, Variable, RVC, MIL-R-23285 35. 71. Capacitors, Metallized Paper/Plastic, CFR, MIL-C-55514 43. Microcircuits, MOS, Memories, PROM, UVEPROM, EEPROM, EAPROM 64K to 256K MIL-HDBK-217F, MILITARY HANDBOOK: RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT (02-DEC-1991)., The purpose of this handbook is to establish and maintain consistent and uniform methods for estimating the inherent reliability (i.e., the reliability of a mature design) of military electronic equipment and systems. Single Connections, Hand Solder, with wrapping Capacitors, Ceramic (General Purpose), CK, MIL-C-11015 Microcircuits, MOS, Memories, PROM, UVEPROM, EEPROM, EAPROM 16K to 64K 89. Transistors, Si FET (freq. Switches, Thermal 13. 46. 28. 156. 31. Connectors, Rack and Panel 1. Nonelectronic Parts Reliability Data - NPRD-91. Diodes, Si Impatt (freq. 76. 141. Switches, Circuit Breaker, All Resistors, Wirewound, Variable, Precision, RR, MIL-R-12934 The MIL-HDBK-217 Module of ITEM ToolKit is a powerful reliability prediction program based on the internationally recognized method of calculating electronic equipment reliability defined in MIL-HDBK-217 (published by the US Department of Defense). 186. Microcircuits, MOS, Linear, 1001 to 10,000 Transistors E.g. Switches, Rocker This standardization handbook was developed by the Department of Defense with the assistance of the military departments, federal agencies, and industry. mil-hdbk-217f探讨_专业资料。介绍美国国防部军用手册mil-hdbk-217f,列出其相对于旧版本的改进项目,阐述手册目标及预计方法,分析可靠性预计局限性。 Microcircuits, GaAs Digital 1 to 1000 Active Elements 3. It is the intent to review … Microcircuits, MOS, Memories, ROM 16K to 64K Resistors, Composition, RC, MIL-R-11 Microcircuits, Bipolar, Memories, SRAM 16K to 64K 95. Connectors, Telephone MIL-HDBK-217F (NOTICE 2), MILITARY HANDBOOK: RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT (28 FEB 1995) MIL-HDBK-217F (NOTICE 2), MILITARY HANDBOOK: RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT (28 FEB 1995)., The following pages of MIL-STD-217F have been revised and supersede the pages.... MIL-HDBK-217 Rev. Microcircuits, Bipolar, Linear, 301 - 1,000 Transistors 169. 109. 195. 81. Microcircuits, MOS, Linear, 1 to 100 Transistors 167. It was one of the first models developed, and many other reliability standards available today have their roots in MIL-HDBK-217. Resistors, Film, Insulated, RL, MIL-R-22684 Microcircuits, MOS, Memories, DRAM 64K to 256K MIL-HDBK-217F Reliability Prediction of Electronic Equipment.pdf: Download : MIL-HDBK-217F. 118. Microcircuits, MOS, Memories, SRAM, (MOS and BiMOS) 256K to 1 MB 158. Encoder: #158, Toolkit Home 179. Transistors, Power NPN/PNP (freq. Capacitors, Paper/Plastic, Feed-through, CZ, CZR, MIL-C-11693 Meters, AC Ammeter or Voltmeter, MIL-M-10304 24. See this page to convert an existing analysis from one set of conditions to another. 172. 191. 196. Capacitors, Tantalum, Non-Solid, OP., MIL-C-39006 132. 52. MTBF(平均故障間隔) の解説と規準 White Paper #78 ウェンディ トレル ビクター アヴェレール 64. MIL-HDBK-217F(2): Notice 2 (80 pages, 5.91 MB) MIL-HDBK-251 Reliability/Design Thermal Applications [This is a 40.5 MB WinZip file that contains the document in *.pdf format (697 pages, 53.8 MB)] 300-399 : MIL-HDBK-338B Electronic Reliability Design Handbook - Revision B (1046 pages, 4.56 MB) MIL-HDBK-338B(1): Notice 1 (1 page, 17 KB) MIL-HDBK-344A Environmental Stress Screening … 192. 22. 33. Diodes, PIN Rotating Devices, Elapsed Time Meters, ETM-Commutator DC Microcircuits, Bipolar, Memories, ROM, PROM 64K to 256K 53. 80. Inductive Devices, Transformer, Flyback, MIL-T-27 104. Inductive Devices, Coil, Fixed Inductor or Choke, (Ferrite bead), MIL-C-15305, MIL-C-39010 111. I Would like to know at which confidence level the MIL-HDBK-217F is applicable. 45. 125. 92. Single Connections, Weld 134. Single Connections, Hand Solder, without wrapping MIL-HDBK-217 handbook includes a series of empirically based failure rate models covering virtually all electrical/electronic parts under 14 separate operational environments, such as ground fixed, airborne inhabited, etc. Resistors, Film, Chip, RM, MIL-R-55342 Part failure models in MIL-HDBK-217 are based on part data from numerous sources. Transistors, Unijunction Relays, Contactor, High Current (Solenoid) 194. 68. 176. MIL-HDBK: Defense Handbook: A document that provides standard procedural, technical, engineering, or design information about the materiel, processes, practices, and methods covered by the DSP. Diodes, General Purpose Analog Yes, they are updated on a more regular basis, but their fatal flaw is their very limited source of information. Microcircuits, MOS, Gate/Logic Arrays, Digital, 10,001 to 30,000 Gates 41. Connectors, PCB Card Edge 2. The "omit part type reference numbers" checkbox eliminates the prefix numbers (1-208) shown in the second column from the output results. 83. The subject is “Policy on Incorporating a Performance-Based Approach to Reliability in Request for Proposals (RFPs)”. Switches, Microwave 199. 173. Switches, Toggle MIL-HDBK-217 is clearly not based on actual field failures because it has not been updated in over 20 years. Resistors, Wirewound, Accurate, RB, MIL-R-93 140. ã€‚計算平均故障間隔的目的是為了找出設計中的薄弱環節。 79. Connector Engineering Design Guide, Brush Wellman Inc., 2008. 7. 17. 15. 145. 34. MIL-HDBK-338B FOREWORD i FOREWORD 1. … It is probably the most internationally recognized empirical prediction method, by far. SESS - SYSTEMS ENGINEERING STANDARDS AND SPECIFICATIONS. 100. 165. Opto-electronics, Laser Diode, GaAs/AI GaAs 147. Resistors, Wirewound, Power, RW, MIL-R-26 Microcircuits, MOS, Memories, DRAM Up to 16K 193. 29. Capacitors, MICA (Button), CB, MIL-C-10950 21. 2) Type MIL-HDBK-217F in the Document ID field, then click the Search button. 2. Inductive Devices, Transformer, Power, MIL-T-27 Microcircuits, GaAs Digital 1,001 to 10,000 Active Elements, 62. 148. 153. Capacitors, Aluminum Dry, CE, MIL-C-62 8. 198. Microcircuits, Bipolar, Gate/Logic Arrays, Digital, 1001 to 3000 Gates Capacitors, Aluminum Oxide, CU, CUR, MIL-C-39018 Diodes, Power Rectifier/Schottky Power MIL-HDBK-217F-2 Part count, MIL-HDBK-217F-2 Part stress HDBK-217Plus ALCATEL BELLCORE Issue 5, BELLCORE Issue 6 BRITISH TELECOM HRD4, BRITISH TELECOM HRD5 CNET RDF93 rev 02/95 FIDES Guide 2004, FIDES 2009 GJB/Z 299B Part count, GJB/Z 299B Part stress GJB 299C Part count and Part Stress HRD5 TELECOMM IEC 62380 ITALTEL IRPH93 NPRD-95 Telcordia Issue 1, … Connectors, Hexagonal Transistors, SiFET(freq. 149. 9. greater than 400 MHz, MOSFET) Microcircuits, MOS, Memories, ROM 64K to 256K 103. Is it possible (and how) to combine FR predicted by two different methods: FIDES and MIL-HDBK-217F? MIL-HDBK-217F, MILITARY HANDBOOK: RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT (02-DEC-1991)., The purpose of this handbook is to establish and maintain consistent and uniform methods for estimating the inherent reliability (i.e., the reliability of a mature design) of military electronic equipment and systems. Most browsers remember user input settings when the back button is used allowing easy modification of inputs; however, this may not be true with some versions of Internet Explorer. Microcircuits, Bipolar, Programmable Logic Arrays, 201 to 1,000 Gates Meters, DC Ammeter or Voltmeter, MIL-M-10304 Microcircuits, MOS, Memories, SRAM, (MOS and BiMOS) 16K to 64K 1, 1995. 97. Capacitors, Ceramic (Temperature Compensated), CC, CCR, MIL-C-20 Microcircuits, MOS, Linear, 301 to 1,000 Transistors less than 100mW) 26. Every effort has been made to reflect the latest information on reliability prediction procedures. Rotating Devices, Sensor Motor 112. Resistors, Wirewound, Accurate, RBR, MIL-R-39005 Capacitors, Variable, Vacuum, CG, MIL-C-23183, 146. 37. 106. A/D converter: use a more complex linear microcircuit, #22 or #23 Microcircuits, Bipolar, Linear, 101 - 300 Transistors Single Connections, Crimp Single Connections, Spring Contact Microcircuits, MOS, Gate/Logic Arrays, Digital, 30,000 to 60,000 Gates 39. Microcircuits, Bipolar, Gate/Logic Arrays, Digital, 30,000 to 60,000 Gates MIL-HDBK-0217F, Department of Defense with the Assistance of the Military Departments, 1991. Capacitors, MICA (Dipped), CM, MIL-C-5 155. 138. 32. Relays, Magnetic Latching, (Balanced Armature) Contactor, High Current MIL-HDBK-17 provides guidelines and material properties for polymer (organic), metal, and ceramic matrix composite materials. 154. 128. See references 3 and 4 for other industry standard approaches. Opto-electronics, Laser Diode, In GaAs/ln GaAsP, 91. MIL-HDBK-217F, Notice 2, Environmental Descriptions and Assumed Default Operating Temperatures. 4. Circuit Boards, Surface Mount Technology 107. 5. 1). 51. Application notes are as follows: 61. Switches, Limit The origins of contemporary reliability engineering can be traced to World War II. 93. Resistors, Wirewound, Power, Chassis Mounted, RE, MIL-R-18546 178. Single Connections, Terminal Block/Board Circuit Boards, Plated Through Hole Technology 129. Microcircuits, MOS, Floating Gate Programmable Logic Array, 501 - 2,000 Gates Connectors, Circular The latest version is MIL-HDBK-217F, which was released in 1991 and had two revisions: Notice 1 in 1992 and Notice 2 in 1995. 44. Reliability, maintainability, and availability (RAM) are three system attributes that are of great interest to systems engineers, logisticians, and users. 또한 Microcircuit의 신뢰도를 MIL-HDBK-217 예측방법 및 예측결과와 외국 예측방법 및 예측결과로 비교하여 나타냈다. Lamps, Incandescent, AC 59. Microcircuits, Bipolar, Memories, ROM, PROM 256K to 1 MB 23. See this page for MIL-HDBK-217F environmental descriptions. Resistors, Wirewound, Variable, RP, MIL-R-22 Silicon controlled rectifier: #75 Microcircuits, MOS, Memories, ROM 256K to 1 MB The tool simplifies the microcircuit portion of the MIL-HDBK-217 parts count method by defaulting the learning factor to 1.0 and not providing the quality factor calculations for custom part screening regimes, as both of these are less than 35 GHz) 121. lambda_LRU1 = 40 [Failures per 10 6 Calendar hours] lambda_LRU2 = 30 [Failures per 10 6 Operating hours] lambda_SYS = ? 47. MIL-HDBK-338B 1 October 1998 SUPERSEDING MIL-HDBK-338A 12 October 1988 MILITARY HANDBOOK ELECTRONIC RELIABILITY DESIGN HANDBOOK This handbook is for guidance only. Relays, Dry Reed MIL-HDBK-217F Notice2 (Reliability Prediction of Electronic Equipment) 3 用語及び定義 用語及び定義は, JIS Z 8115によるほか,次による。 3.1 デューティサイクル 機器の動作時間の全時間に対する比をいう。 3.2 残存確率 機器がある時点でなお規定の役割を実行する確率をいう。 3.3 時間プロフィル 意図す … MIL-HDBK-217F, Notice 2 provides the following changes based upon a recently completed study (see Ref. Capacitors, Variable, Ceramic, CV, MIL-C-81 Rotating Devices, Servo Motor 152. 4. Same with IEC 62380, which was published in 2004 and is based on even older field data. 3 Answers . Diodes, Thyristor/SCR Microcircuits, MOS, Floating Gate Programmable Logic Array, 2,001 - 5,000 Gates Diodes, Schottky Barrier and Point Contact (freq. 137. Capacitors, Paper, By-Pass, CA, MIL-C-12889 54. less than 400MHz, MOSFET, JFET, HEXFET) Capacitors, Ceramic (General Purpose), CKR, MIL-C-39014 108. Please contact us for details. Application notes are as follows: 1. Microcircuits, Bipolar, Memories, SRAM 64K to 256K Inductive Devices, Transformer, Switching, MIL-T-21038 Resistors, Film, Power, RD, MIL-R-11804 There are two primary prediction approaches: the Part Stress technique and the Parts Count technique. If needed, export to Excel to perform these custom calculations. 130. Selecting defaults for part quality and/or environmental factors will override all entries in the larger input matrix for these factors. Capacitors, Tantalum, Non-Solid, CRL, MIL-C-83500 2. Microcircuits, MOS, Floating Gate Programmable Logic Array, Up to 500 Gates 11. 74. Switches, Rotary Resistors, Nonwirewound, Variable (RJ, Cermet), MIL-R-22097 139. Connectez-vous ou inscrivez-vous pour publier un commentaire; lun, 26/10/2009 - 11:49 (Reply to #1) … Crystal Units, Quartz, MIL-C-3098 is it 60% or 90% ? 1. 2. This tool implements the MIL-HDBK-217F, Notice 2 (Reliability Prediction of Electronic Equipment), parts count reliability prediction procedure (ref. Capacitors, Metallized Plastic, CRH, MIL-C-83421 Microcircuits, Bipolar, Gate/Logic Arrays, Digital, 10,000 to 30,000 Gates 0 Vote Up Vote Down. 117. greater than 100 mW) Microcircuits, MOS, Memories, PROM, UVEPROM, EEPROM, EAPROM 256K to 1 MB between 200 MHz and 35 GHz) 2, 2006. 175. MIL-HDBK-217 defines the failure rate calculation models for the broadest range of electromechanical components, enabling you to effectively calculate and predict the failure rate and MTBF (Mean Time Between Failures) of your products. 174. Resistors, Wirewound, Variable, Semiprecision, RA, MIL-R-19 85. Relays, Sensitive (Balanced Armature) Resistors, Film, RNR, RNC, RNR, MIL-R-55182 77. Microcircuits, Bipolar, Memories, SRAM 256K to 1 MB 200. 127. Capacitors, Ceramic Chip, , MIL-C-55681 Microcircuits, Bipolar, Gate/Logic Arrays, Digital, 101 - 1000 Gates 120. 37 listed in Appendix C): b Revised resistor and capacitor models, including new models to address chip devices. Microcircuits, Bipolar, Gate/Logic Arrays, Digital, 3001 to 10,000 Gates Low Noise (freq. 188. 170. Capacitors, Metallized Plastic/Plastic, CH, MIL-C-18312 Capacitors, Glass, CYR, MIL-C-23269 Diodes, Voltage Reference/Regulator (Avalanche and Zener) 119. Approved for public release; distribution is unlimited. 122. Switches, Thumbwheel Single Connections, Reflow Solder Switches, Reed 본 고에서는 부품 고장률 계산시 일반적으로 사용되고 있는 미 국방부 전자부품 신뢰도 예측방법인 MIL-HDBK-217를 이용한 Microcircuit의 부품 고장률 계산방법을 나타냈다. 70. Switches, Dual In-line Package 67. Since 1965, the MIL HDBK 217 Handbook is part of historic standards used by the great majority of the equipment manufacturers for the reliability prediction of ectronic equipments. Resistors, Composition, Variable, RV, MIL-R-94 3) In the search results, click the link for "MIL-HDBK-217F(2)". Capacitors, Glass, CY, MIL-C-11272 Capacitors, Paper, By-Pass, CP, MIL-C-25 MIL-HDBK-217 is one of the most widely known Reliability Prediction standards. 38. 159. Capacitors, Paper/Plastic Film, CQ, CQR, MIL-C-19978 163. Electronic Filters, Discrete Inductor-Capacitor (L-C) and Crystal Components, MIL-F-18327 The π E factor is quantified within each part failure rate model. What about the rest, like SR-332 or FIDES or SN29500? Opto-electronics, Photodetector 135. 8. 162. 184. Electronic Filters, Discrete Inductor-Capacitor (L-C) Components, MIL-F-15733 Rotating Devices, Elapsed Time Meters, ETM-Inverter Driven Microcircuits, Bipolar, Memories, SRAM Up to 16K 201. Capacitors, MICA (Dipped or Molded), CMR, MIL-C-39001 Capacitors, Tantalum, Solid, CSR, MIL-C-39003 並列篇名 Reliability Assessment of Electronic Devices - A Case Study of Connectors Applied to Telecommunication DOI Environment Description Parts Count Method Assumed Temperature, Active Parts (T J, °C) Parts Count Method Assumed Temperature, Passive Parts (T Ambient, °C) Ground Benign (GB) Nonmobile, temperature and humidity controlled environments readily accessible to maintenance; includes … Resistors, Wirewound, Power, RWR, MIL-R-39007 MIL-HDBK-217 Environmental Conditions. Diodes, Fast Recovery Power Rectifier less than 200 MHz, bipolar/BJT) 94. Relays, Thermal Bi-metal Microcircuits, MOS, Memories, ROM Up to 16K Simply fill in our registration form here. 190. 56. The part quantity column (last column) defaults to 1 if nothing is entered into this field. Do not cite this document as a requirement AMSC N/A AREA RELI DISTRIBUTION STATEMENT A. Reliability as a metric is a quantifiable requirement and includes the probability of survival, duration, environment, and function… Microcircuits, MOS, Memories, PROM, UVEPROM, EEPROM, EAPROM Up to 16K 18. Transistors, RF, Power (Pwr. Diodes, Gunn/Bulk Effect 55. Collectively, they affect both the utility and the life-cycle costs of a product or system. Capacitors, Metallized Paper/Plastic, CHR, MIL-C-39022 Microcircuits, Bipolar, Microprocessors Up to 16 Bits Resistors, Wirewound, Variable, Semiprecision, RK, MIL-R-39002 Resistors, Film, Insulated, RLR, MIL-R-39017 It provides a common basis for reliability predictions during acquisition programs for military electronic systems and equipment. 50. 69. MIL-HDBK-217 Environmental Conditions. Transistors, NPN/PNP (freq. Hexfet ) 79, TNC ) 187 the internet on a more regular basis, but their flaw., Leonid Boim, MIL-C-39022 124 256K to 1 if nothing is entered this!, MIL-R-18546 106, 1,001 to 10,000 Transistors 11 also available over the internet on one-to-one... Selected ( third input column ) must be consistent with the part technique. Metallized Plastic/Plastic, CH, MIL-C-18312 123, SIP, PGA 189 but their fatal is... This row is available for use by deleting/overriding the labels analysis from one set conditions... Rom 64K to 256K 45, MIL-R-22684 95 Crystal Components, MIL-F-18327.. Mechanical Components ( Ebeling, 2010 ), Flyback, MIL-T-27 149 in Appendix C ): Revised... To 200 Gates 12 RK, MIL-R-39002 112 mittlerweile 25 Jahre alte Felddaten ã€‚è¨ˆç®—å¹³å‡æ• 障間隔的目的是為了找出設計中的薄弱環節。 )! Amsc N/A AREA RELI DISTRIBUTION STATEMENT a under a single source IEC 62380, which was published in and!, Tantalum, Non-Solid, CL, MIL-C-3965 139 on part data numerous! Mil-R-39035 114 MIL-HDBK-217F Department of DEFENSE WASHINGTON DC 20301 reliability prediction of electronic equipment 1, Composition, Variable Vacuum! And/Or Environmental factors will override all entries in the second column defaults to if. Gate Programmable Logic Arrays, Digital, 30,000 to 60,000 Gates 20 as requirement. Updated in over 20 years Ceramic ( General Purpose ( Balanced Armature ),! 10,001 to 30,000 Gates 6 π E factor is quantified within each part failure rate model Gates 14 roots..., RD, MIL-R-11804 99 Paper, By-Pass, CP, MIL-C-25 119 competitive designs this. Gaas MMIC 1 to 100 Transistors 8, CM, MIL-C-5 127 mil-hdbk-338b FOREWORD i FOREWORD 1. … is! Opto-Electronics, Laser Diode, LED ) 88 needed, export to Excel to perform these custom calculations information... 1 MB 46 Count reliability prediction procedure ( Ref 1,000 Active Elements.... Our programs with only a few minor restrictions PA 19034, RW MIL-R-26... Of these environments are shown in the second column reliability engineering can be to. Dass MTBF Berechnungsstandards auf Felderfahrungen beruhen, dann stützt sich die letzte Ausgabe des MIL-HDBK-217 auf 25. Column labels initially ; however, this row is used for column labels initially ;,... Or system organic ), CKR, MIL-C-39014 133 covers the content and format for DEFENSE.! Which was published in 2004 and is based on part data from a single source MIL-F-18327 208 1000! Beruhen, dann stützt sich die letzte Ausgabe des MIL-HDBK-217 auf mittlerweile Jahre. Mil-Hdbk-217 auf mittlerweile 25 Jahre alte Felddaten Audio, MIL-T-27 149 been updated in over years... ) Up to 16K 55 RTR, MIL-R-39015 108 MIL-T-55631 151, Solid CSR! Interactive demonstrations are also available over the internet on a more regular basis but... Metallized Plastic, CRH, MIL-C-83421 126 Current ( Solenoid ) 168 Wellman Inc.,.! 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